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人工智能的下一个瓶颈:为何美国制造的顶级芯片仍需往返台湾_蜘蛛资讯网

2只大象打斗砸死人

翰・韦尔维表示:“如果企业不主动进行资本开支投入,以应对未来几年晶圆厂产量的激增,封装环节很快就会变成瓶颈。”  在一次罕见专访中,台积电北美封装解决方案负责人保罗・卢梭向 CNBC 表示,相关需求数据 “正大幅增长”。  台积电目前应用的最先进技术名为晶圆上芯片基板封装(CoWoS),卢梭称其复合年增长率高达惊人的 80%。  人工智能巨头英伟达已预订台积电这一封装龙头绝大部分的先进产能。  而

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